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This text explores new developments in the modeling of composite materials. It fully covers multiscale concepts and other developments such as coupling stress analysis and diffusion phenomena that arise from hygral and/or thermal loading.
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This text explores new developments in the modeling of composite materials. It fully covers multiscale concepts and other developments such as coupling stress analysis and diffusion phenomena that arise from hygral and/or thermal loading.
Skryť popis
- Nakladateľ: Springer-Verlag New York Inc.
- Kód:
- Rok vydania: 2008
- Jazyk: Angličtina
- Väzba: Hardback
- Počet strán: 237
- Šírka balenia: 24.2 cm
- Výška balenia: 16.5 cm
- Hĺbka balenia: 2.2 cm
- Váha balenia: 542 g
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