Chapter 1 Predictive Reliability of Embedded Electronic Systems§Chapter2 Measuring Method of the Internal Temperature of Electronic Components§Chapter 3 Dynamic Analysis of Mechatronic Components by Laser Vibrometry§Chapter 4 Measurement of Static and Vibratory Deformations and Displacements by Full Field Methods§Chapter 5 Characterization of the Electromagnetic Environment of Microwave Frequency Circuits§Chapter 6 Characterization of the Behavior of Radiofrequency Power Transistors under Thermal and Electromagnetic Stresses§Chapter7 Characterization of the Ability of Switching Transistors to Resist to Electrical Overstress§Chapter8 Spectroscopy of Non-destructive Characterizations of the Interface Physics of Mechatronics Devices§Chapter 9 Study of the Dynamic Contact between Deformable Solids Skryť popis