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This book presents the latest developments in packaging for high-frequency electronics. Topics include thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods and other RF/MW packaging-related fields.
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This book presents the latest developments in packaging for high-frequency electronics. Topics include thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods and other RF/MW packaging-related fields.
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- Nakladateľ: Springer-Verlag New York Inc.
- Kód:
- Rok vydania: 2009
- Jazyk: Angličtina
- Väzba: Hardback
- Počet strán: 285
- Šírka balenia: 16.5 cm
- Výška balenia: 24.2 cm
- Hĺbka balenia: 2.3 cm
- Váha balenia: 594 g
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