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Účet
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl.
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This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl.
Skryť popis
- Nakladateľ: Springer International Publishing AG
- Kód:
- Rok vydania: 2016
- Jazyk: Angličtina
- Väzba: Hardback
- Počet strán: 339
- Šírka balenia: 24.1 cm
- Výška balenia: 16.6 cm
- Hĺbka balenia: 2.6 cm
- Váha balenia: 694 g
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